What the buyer sees and feels
Map softness, stretch, surface friction and lining choices to the headphone or headphone zone and wearing time.
MATERIAL / PROCUREMENT NOTES
Microphones and PCB
Coordinate mic array, DSP, Bluetooth module, antenna, firmware and EMC documentation. The selected composition, weight, finish and documentation are confirmed per order.
Ask for a material pack ↗
What the headphone or headphone must survive
Record abrasion, moisture, recovery, pilling, shade and assembly and cleaning checks that matter for the brief.
What the buyer needs
Request composition, test scope, cleaning-label data and change control before the first production run.